Cesic, a C/SiC technology from ECM Ingenieur-Unternehmen of Munich, Germany, is a ceramic matrix composite of high stiffness, high thermal conductivity and low thermal expansion from room to cryogenic temperatures. The short manufacturing cycle time required yields a material that can be easily machined using conventional techniques into virtually any complex shape. The material can be joined, and shows no discontinuities in mechanical or thermal properties at the joint interface. This seamless joining feature allows for component sizes as large as five by eight feet (1.5 by 2.5 meters).
