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Product Name: Power modules handle up to 8 amps
Product Description
Adelberg, Germany — ERNI's MicroSpeed Power Modules combine high current-carrying capability up to 8 amps with flexible stacking heights. These 2.0-mm pitch power module connectors meet the industry's need for small and high reliability power systems, while offering several options for mezzanine applications.
ERNI said one of the unique features of the MicroSpeed module is its high current-carrying capacity in comparison to its small size. Based on a special contact material, the connector system achieves up to 6 to 8 amps at 20°C, which means the system is suitable for use with small, high-performance devices such as CPUs, drives, and LCD panels.
Providing a variety of height versions for the male (1, 2, 9 and 10 mm) and female (4, 6, 8 and 10 mm) connectors, the Power Module series enables stacking heights from 5 to 20 mm to address a variety of PCB arrangements. Another major advantage is the multiple-connector mating capability, which allows for the mating of more than one connector pair at the same time. The operating temperature range is -55°C to 125°C.
The Microspeed Power Modules use pins with SMT termination. For the shield metal sheet, two termination options are available: SMT for standard applications and THR shield pins with high retention forces for harsh environments. In addition, maximum wipe length is guaranteed within the smallest board-to-board distance.
The contacts are post plated, leaving no bare edges in the contact and solder areas. The connectors are equipped with polarized positioning pegs, and the connector plating is lead free, complying with the European RoHS directive.
The SMT connectors are also compatible with automatic assembly machines. They are manufactured and 100% inline quality checked by machine to ensure high co-planarity and optimized soldering, said the company. The layout is designed with an optimal solder pad size to guarantee high retention forces. The integrated 3-point double beam female contact ensures low-contact resistance over the entire lifecycle.
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