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Date: 09 January 2009
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Thermal Management  
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Thermal Management

Product Name: Thermal Management

Product Description

Flat conductors have a much greater surface to volume ratio than round wire. This extra surface area facilitates the dissipation of heat away from the circuit: heat is easily dissipated from both sides of the flexible circuits, the thin polyimide dielectric permitting a relatively easy thermal path. In rigid boards the dielectric substrate is a thermal insulator inhibiting the flow of heat, and this can be a reason to substitute using flex.

Company Details

Our company was incorporated in 1980. It was founded by three senior ex -IBM technical employees. The flexible circuits plant which consists of two factories covering 24,000 sq. feet was the first in Europe to be designed and built solely for... more

More Products of this Company: Flexible circuits our domain, Packaging; reduced Weight and Space requirements, Surface Mount Technology
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