Trade.Information

Product Name: Thin Film and Plasma Process Capabilities

Product Description

MicroConnex' thin film capabilities include the deposition of high quality films of metals, semiconductors, oxides, and nitrides. Substrates can be up to 6 inches (150 mm) in diameter, with excellent thickness uniformity. Sputter etching (Ar) and reactive ion etching (RIE) (O2, CF4) allow cleaning and activation of substrate surfaces for optimum adhesion. Using our efficient DC/RF magnetron sources allows us to deposit films onto delicate substrates such as thin polymers or ferroelectric and piezoelectric materials. Dielectrics can be deposited by RF or by using metal targets and reactive sputtering. Up to four different materials can be sputtered onto substrates without breaking vacuum. Our in-house profilometer allows us to provide films with highly reproducible thickness. The practical thickness range for sputtered films is 0.005 µm to 2 µm, with thickness tolerance down to +/- 0.001 µm. If additional gold, nickel, or copper is required, we can easily plate up parts in our fine pitch flex circuit shop. If you require films of materials other than those listed below, please contact us about adding your materials to our list. Features of our thin film equipment include: Two magnetron sputter sources (Ag, Al, Au, B2 alloy, constantan, Cr, Cu, Ir, Ni, Nichromeª, Si, Ti, TiW, Zr) Two planar RF diodes (Cr, Ir, Si3N4, Ti) RF sputter etch Plasma RIE (multiple panels up to 18" x 22" (46 cm x 56 cm) Processing of temperature-sensitive materials Low base pressure (< 8.0x10-8 Torr) and liquid nitrogen cold trap Metal films are clean, with excellent adhesion to any substrate Planetary drive allows excellent thickness uniformity across substrates up to 6" (15 cm) diameter 6 kW DC and 2 kW RF Reactive sputtering of IrO2, TiOx, Al2O3, TiN, TiWOx, TiWN, NiMoFeOx Thin films for PCB, resistors, thermistors, thermocouples, IR detectors Thermal evaporation of thermoelectric materials (Bi, Te, Se, Sb) Applications: MicroConnex' high quality films are useful for many different applications. We typically deposit materials for flex circuits or electrical contacts, and optical, resistive, and sensing films. We often work with customers to develop new films. Applications in which MicroConnex films are being used include: Fine-line flexible circuits and interconnects Bonding (e.g., Au for wire bonding, soldering, or Au-Si eutectic bonding) Reflecting films for optics Sensing films (including nanoparticles) for medical devices Strain sensors Temperature sensing (thermocouples and thermistors) Diffusion barriers Implantable electrodes and other medical devices IR detectors At MicroConnex we work closely with all of our customers to make sure they receive the very best services and products that we can provide.

Company Details

MicroConnex began commercial operations in 2001 with the mission to provide the highest quality design and manufacture of ultra high-density interconnect (HDI) flexible circuits to original equipment manufacturers (OEMs). MicroConnex uses... more