Trade.Information

Product Name: Electroform Stencils

Product Description

Electroform technology delivers ultimate control over stencil thickness and uniformity, ensuring outstanding paste volume consistency for fine pitch applications. Electroform stencils provide superior performance and ensure seal contact to the pad(s), pad paste deposit and a greater percentage volume of paste on pad. The reactive force created by these stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture. Electroform stencils are very effective for printing paste on SMT boards with fine pitch parts spread over a large area and provide excellent print performance for applications with miniature BGAs, ultrafine pitch QFPs and small components such as 0201s. Electroform is also the perfect enabling technology for packaging applications such as wafer bumping. And, as the industry transitions to lead-free manufacturing, Electroform stencils will become a necessity, as they improve solder paste release for some of the more challenging lead-free paste formulations.

Company Details

DEK is the world’s leading provider of equipment and processes for the high accuracy mass imaging of electronic materials. Through the combined strength of machines, stencils and screens, consumables and process support products, we deliver total... more