Parameter Boudry site Moudon site
Line width/space 40/40 µm 80/80 µm
PTH (laser) 100 µm -
Blind vias (laser) 75 µm -
PTH (mechanical) 150 µm 200 µm
Blind vias (mechanical) 200 µm -
Pad diameter via diameter + 0.30 mm via diameter + 0.30 mm
Min. thickness 50 µm 100 µm
Max. thickness 2.5 mm 2.2 mm
Max. panel size 610 x 457 mm 410 x 260 mm
Max. board size 570 x 410 mm 390 x 240 mm
Number of layers up to 8 1-2
Nickel 3-15 µm 3-15 µm
Soft gold flash to 1.2 µm 0.1-1.2 µm, 80-120 HV
Hard gold flash to 0.3 µm 0.1-0.3 µm, 380-450 HV
Soldermask thickness 20 ± 5 µm 10-75 µm
Electrical Test 100 % -
AOI 100 % 100 %
Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!
Company Details
Cicorel is a leading manufacturer of High Density Interconnect (HDI) solutions, offering a complete range of custom flex, rigid and rigid-flex printed circuit boards (PCB) to meet the most demanding requirements of high-technology and... more
