Post-dicing inspection offers the last opportunity to capture defects from preceding processes while the dice are still packed in wafer format. Camtek’s Falcon 500PD line of automatic framed wafer inspection systems delivers superb detection of surface and probe mark defects, bump size and placement deviations, as well as dicing-related defects.
Separated from each other in dicing, individual die may shift and rotate relative to their original position in the wafer, getting out of registration with the reference wafer.
The Falcon 500PD overcomes this problem by virtually aligning and registering the die in real time during scanning. The optional Quick Exchange Station increases throughput by speeding the wafer loadunload cycle.
