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Product Name: Manufacturing Specification
Product Description
ITEM TECHNICAL PARAMETER
1 Min.Line Width : 0.1 mm
2 Min.Space : 0.1 mm
3 Min.Annular Ring Width : 0.1 mm
4 Min.Hole Size : 0.2 mm
5 Layers : 1-20 Layers
6 Board Thickness(Double Side) : 0.2 mm-3.2 mm
7 Board Thickness(Multilayer) : 0.4 mm-6.0 mm
8 Board Size : 40050 mm
9 PTH Copper Thickness : 25 µm
10 Material : FR1, FR4, BT RESIN, ROGERS, GETEK, ALUMINUM CLAD
11 Finishing : HAL, HAL + GOLD FINGER, ELECTROLYTIC NICKEL GOLD, IMMERSION TIN, ENIG
12 Solder Mask Color : Green, Black, White, Blue
13 Legend Color : Black, White
Company Details
Since being established in 1994 APC has gained the reputation to be the most committed high quality printed circuit boards manufacturer in Malaysia for Prototypes and Small & Medium Production with fast and prompt delivery. We delivery in 24... more
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