Number of Layers: 2 to 12
Minimum Line Width & Spacing: 5/5 Mils
Finished Board Thickness: 12 to 93 Mils
Finished Hole Size: 12 Mils
Minimum SMD Pitch: 16 Mils
Layer to Layer Registration: +/- 5 Mils
Solder Mask Printing Registration: +/- 3 Mils
Hole Size Tolerance: +/- 2 Mils
Aspec Ration: 6:1
Maximum Board Size: 20" x 24"
Hot Air Solder Leveling
Chemical Nickel Gold
Anti-Tarnish Coating ( Entek Process )
Gold Emersion
Blind and Buried Vias
Material: FR4, FR2, CEM1, CEM3
Company Details
WorldAmerican PCB International, Inc. (WPI) is a division of Woody Industrial Corporation, a major investment group in Taiwan. The majority of the groups investments are in factories that produce Printed Circuit Boards (PCBs). Our quality two (2)... more
