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Product Name: MCM-L
Product Description
MCM-L is a high density interconnect device. Generally consisting of glass reinforced laminates up to 22 layers with blind and buried via technology, this product allows interconnect and attachment of bare integrated circuit die. Using a refined subtractive process, fine line width and spacing technology along with small hole drilling can be achieved. Intermediate conformal packages (e.g. DIPs, Quad Flat Packs, PGAs, SMT) are eliminated which results in size, weight, and power savings. Multiple methods of attachment of the bare die promote flexibility and reduced cycle times. Military certification is available.
Company Details
Speedy Circuits is the leading manufacturer of technically demanding printed circuit boards, flex circuits, rigid-flex circuits, multichip modules (MCM-L), metal core boards and RF/microwave boards in fast turn prototype to medium volume... more
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