Trade.Information

Product Name: Package and Other Component Design

Product Description

A high speed package design requires the knowledge of the behavior of the I/O circuits employed to drive and/or receive signals from the integrated circuit (IC) through the package. In addition to layout, critical structures such as vias and solderball regions should be modeled with electromagnetic (EM) solvers. If the IC to be packaged is custom, then the I/O design should be undertaken simultaneously with the package design. Package designs should be undertaken to meet important design criteria such as limiting simultaneous switching noise (SSN) to acceptable levels. For testing ICs, a conventional IC package may not be the most cost effective solution. Instead a simpler component called chip carrier can frequently offer higher electrical and thermal performance than that of a conventional IC package. Other Components: Components such as high speed connectors, cables, and so on can be evaluated to see if they meet electrical performance criteria. We can recommend how to use commercially available parts to maximize the electrical performance. For example, optimal power, ground, and signal assignment of a multi-pin connector can dramatically improve maximum date rate through the connector. In many instances, EM simulation can be utilized for package and component designs to produce electrical models. These models can be simulated with SPICE to predict effects of I/O, power, and ground assignments to predict maximum operating frequencies