Trade.Information

Product Name: MetGraf™ Thermal Management Products

Product Description

Thermal Management Solutions

Overview

Electronics thermal management technology is revolutionizing the way the world communicates and conducts business. Today’s products, from cellular phones to sophisticated imaging satellites require innovative composite materials that provide more functionality in less volume. Electronic systems must dump large amounts of waste heat more effectively and balance thermal stresses created by dissimilar materials. MetGraf™ aluminum and copper graphite composites are lightweight, high thermal conductivity, low expansion alloys ideally suited for heat sinks, base plates, carrier plates, and thermal spreaders. Markets include; computers, telecommunications, automotive (HEV), power semiconductor, opto-electronics, military and aerospace, heavy transportation, space systems and satellites, medical, and industrial lighting. Applications within these markets include; microwave, RF, IGBT, micro-electronic packaging, laser diode, HB-LED’s, and advanced radar.

Al MetGraf™ Aluminum Graphite Composites

MetGraf composites are cast as plate, machined to print and plated with Ni, Au, or Ag. MetGraf is a high speed machining material into complex shapes to tight tolerances and surface finish. MetGraf is in production for military and commercial applications, including wireless communications, power semiconductor, satellite, and semiconductor equipment. MetGraf is a candidate for matched thermal expansion (CTE) applications that require high thermal conductivity. MetGraf can be designed into new systems or used to replace traditional materials like molybdenum, iron-nickel alloys (Kovar), copper tungsten, copper moly, aluminum, or copper.
 

Cu MetGraf™ Copper Graphite Composites

MMCC offers Cu MetGraf copper graphite composites for thermal management. Copper graphite has excellent thermal conductivity and is 62% lighter than Cu/W. Copper graphite is a high speed machining material to tight tolerances and surface finish. Plating specs: Electroless Ni - MIL-C-26074E , Electrodeposited Au - MIL-G-45204C.
 

MetGraf™ w/In-Situ Cast TPG Thermally Enhanced Solutions for Hot-Spot Remediation
Utilizing the high in-plane thermal conductivity of Thermal Pyrolytic Graphite (TPG - 1700 W/Mk), these solutions have internal low thermal resistance paths inside MetGraf™, composites for lateral edge cooling or through thickness sinking applications. In-situ cast TPG thermal enhancements are aimed primarily for CTE matching to GaN, SiC, and GaAs power packaging applications. (TPG is a product of Momentive Performance Materials)

Company Details

Metal Matrix Cast Composites, LLC manufactures highly loaded MMC's using ceramic particulate and graphite fiber reinforcements in non-ferrous matrices. Our materials provide performance enhancements over traditional metal components that are... more