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Date: 03 December 2008
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Product Description

Complete assembly of all configurations of surface mount, mixed technology formats, and advanced packaging using either customer furnished components or components purchased by Wytan from validated, qualified sources. Wytan provides prototype through volume production

Company Details

We are a Golden, Colorado based electronics manufacturing services company specializing in surface mount and other emerging assembly technologies, including BGA (Ball Grid Array), Micro BGA, CSP (Chip Scale Packages), and FC (Flip Chip). Our... more

More Products of this Company: Manufacturing Facilities and Equipment, Producibility Engineering, Quality, Test Capability
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