Trade.Information

Product Name: Packaging Design

Product Description

many OEMs, designing “the box”—the enclosure that houses the printed circuit board—is often not economical due to the investments involved in the total engineering effort to design the enclosure. Today, many companies are finding that outsourcing the package design responsibilities to a company like MEC allows them to concentrate on core competencies. MEC’s team of project engineers have years of experience in designing: standard enclosures custom metalwork injection molded casings

Company Details

Originally founded in 1954 by Mr. Hyman Smith, the company operated out of a small backroom at a plant on Hopkins Street in Milwaukee, Wisconsin. The company produced electronic test instruments used in testing for electrical defects in products.... more