Zarlink\'s CESoP (Circuit Emulation Services-over-Packet) packet processing
technology transparently \"tunnels\" circuit-based TDM traffic with carrier-grade
quality over many types of packet networks.
Zarlink\'s CESoP technology allows carriers to reduce operating costs by
transporting revenue-generating legacy services over an efficient packet
infrastructure. With integrated memory and synchronization features, Zarlink\'s
CESoP processors are easy to implement. We offer low- to high-capacity CESoP
processors capable to transporting up to 32 T1/E1 streams of TDM-based voice,
video and data traffic - with all timing information maintained - through IP,
MPLS, L2TPv3, and Ethernet networks.
CESoP processor is a highly functional TDM to Packet bridging device
providing both structured and unstructured circuit emulation services (CES) for
T1 and E1 streams across a packet network based on MPLS, IP or Ethernet. The
ZL50120 also supports unstructured J2, T3, E3 and STS-1. The device incorporates
a range of powerful clock recovery mechanisms for each TDM stream and a dual
Ethernet interface to aggregate data traffic with voice traffic.
Features & Benefits
Circuit Emulation Services over Packet (CESoP)transport for MPLS, IP and
Ethernet networks
On-chip timing & synchronization recovery across a packet network
On-chip dual reference Stratum 3 DPLL
Grooming capability for Nx64 kbps trunking
Fully compatible with Zarlink\'s ZL50110, ZL50111 and ZL50114 CESoP
processors
TDM Interface provides 128 bi-directional 64 Kbps channels or 4 T1/E1, 1
J2, 1 T3/E3, or 1 STS-1 ports
Compatible with H.110, H-MVIP, ST-BUS backplane
Direct connection to LIUs, framers, backplanes
100 Mbps MII interface for user data traffic
100 Mbps MII FE or 1000 Mbps GMII/TBI interface for network uplink
Flexible, multi-protocol packet encapsulation including IPv4, IPv6, RTP,
MPLS, L2TPv3, ITU-T Y.1413, IETF CESoPSN, IETF SAToP and user programmable
Complies with ITU-T recommendation Y.1413, IETF PWE3 draft standards
CESoPSN and SAToP and CES draft IAs from MEF and MFA
Zarlink Semiconductor delivers world-leading, mixed-signal chip technology
for a broad range of communications, optical and medical applications. The
Company's core capabilities are in network timing, voice enhancement, optical
interconnect... more
