Trade.Information

Product Name: IC Package (Ceramics)

Product Description

Pin grid array (PGA)

Application
This package is equipped with advanced IC chips, such as ASIC, used mainly for the MPU of a computer and communications equipment.

Material
The main body consists of co-firing multilayer alumina ceramics, and pin terminals made of an alloy of iron, nickel, and cobalt are attached with silver-brazing to the main body.

Features
This package, in which there are ultra-fine wiring circuits created based on a ceramic multilayer wiring structure, supports multifunctional electric properties and can create an integrated built-in capacitor. The external terminal is used not only for socket installation but also supports a fine pitch for surface installation. In addition, it can support cases where external terminals with 400 pins or more is needed.

Package for crystal device and SAW filter, SMD type

Application
This product is an SMD-type package used for crystal oscillators, crystal transmitters, and SAW filters for communications equipment.

Material
The main body consists of co-firing multilayer alumina ceramics and, if necessary, a metal ring for sealing that is made of an alloy of iron, nickel, and cobalt is attached with silver-brazing to the main body.

Features
It is an ultra-compact and slim leadless ceramic package for surface installation created in order to reduce communication equipment in size and weight.

Package for crystal device and SAW filter, CSP type

Application
This product is a CSP-type package used for crystal oscillators, crystal transmitters, and SAW filters for communications equipment.

Material
The main body consists of co-firing multilayer alumina ceramics.

Features
This product is a panel-type CSP ceramic package for ultra-compact and slim devices, each of which measures 2.0 mmSQ and is difficult to handle separately.

Package for camera modules

Application
This product is a package for compact cameras installed in mobile phones and PCs.

Material
The main body consists of co-firing multilayer alumina ceramics.

Features
It uses a ceramic material with high dust-resistance that is needed in optical devices.



Package for MEMS and various sensors

Application
This product is an air-tight, highly reliable package used for various sensors, such as gyro sensors, GPS, and air bags.

Material
The main body consists of co-firing multilayer alumina ceramics and, if necessary, a metal ring for sealing that is made of an alloy of iron, nickel, and cobalt is attached with silver-brazing to the main body.

Features
This package is best suited for the protection of sensor devices from the external environment.

Side blaze package

Application
This package can be used for broad range of purposes.

Material
The main body consists of co-firing multilayer alumina ceramics, and lead terminals made of an alloy of iron and nickel are attached with silver-brazing to the main body.

Features
It is a multipurpose package, also called a DIP package. It can meet the demand for skinny types for which the width of the package is shortened, shrink types for which the length of the external terminal pitch is shortened, and J lead types.

Quad flat package

Application
This is a surface-installation type package used for the ASIC for industrial and communications equipment.

Material
The main body consists of co-firing multilayer alumina ceramics, and lead terminals made of an alloy of iron and nickel are attached with silver-brazing to the main body.

Features
Because the lead pitch is ultra-fine (0.5 mm or less), it can meet the demand for a compact and slim package with high packaging density of 200 pins or more.



Package for flip chips

Application
This product is a package equipped with advanced IC chips, such as ASIC, used mainly for the MPU of a computer and communications equipment.

Material
The main body consists of co-firing multilayer alumina ceramics, and pin terminals made of an alloy of iron, nickel, and cobalt are attached with silver-brazing to the main body.

Features
The package and the minute pad surface of the IC chip are soldered face-to-face, and the chip and the package are connected at the same time as an electric connection. Due to the short connection distance and the simultaneous connection, the speed of signal transmission becomes higher and the productivity of the assembly work improves.

Package for high frequency

Application
This package meets the demand for high frequency and high output that are necessary for GaAsFET, high output FET, and MMIC.

Material
The ceramic is alumina ceramics and a heat releasing plate made of an alloy of Cu, etc., and a lead terminal made of iron, nickel and cobalt is attached with silver-brazing.

Features
Electrical and heat properties in the high-frequency band are optimally designed through simulation.

Package for opto-devices

Application
This package is used for high-speed long-distance transmissions and metro/access transmissions, and it is equipped with light emitting devices (LD) and light receiving device (PD).

Material
This is a butterfly-type package in which metal case fittings, sleeves, and lead terminals are attached to the multilayer ceramic field-through with silver-brazing.
This type of package includes Mini-DIL and Mini-FLAT packages in which the sleeve and lead terminal are attached to the multilayer ceramic case with silver-brazing.
In addition, it is possible to braze an optical window material in the sleeve for a specific purpose.

Features
This air-tight, highly reliable package enables a more flexible design due to ceramic multilayer wiring.

Custom package

Application
This package is used for the high-density multilayer wiring substrates and MCM substrates, such as high-end high-frequency module substrates, used for information processing equipment or communications equipment.

Material
The main body consists of co-firing multilayer alumina ceramics, and a pin or lead terminal made of an alloy of iron, nickel, and cobalt is attached with silver-brazing to the main body.

Features
This product can be optimally designed to meet customer needs: acceleration of signal transmission and higher-density installation.



Thin film wiring substrate

Application
This product is used for ultra-fine high-density wiring substrates for information processing equipment including computers. It is an active and passive circuit used for the RF (high frequency) section of communications equipment. It is suitable for module substrates for which L (inductance) and R (resistance) are created at the same time as wiring.

Material
The wiring is Cu and Au with low resistance and low-loss. The resistance is of the Ta2N series.

Features
Wiring with high density and low-loss can be created on a compact and slim substrate.

Substrate for probe card

Application
This product is used for super-sized, high-density, high-precision multilayer substrates used for the testing of silicon wafers.

Material
High-precision terminals are created on the alumina ceramic multilayer substrate of which the number of layers is more than 20 by using thin film techniques.

Features
It supports the multi-DUT in order to improve the testing efficiency as the size of the silicon wafer becomes larger.

LTCC/multilayer substrate

Application
This product is used for multilayer substrates for mobile communication modules (front-end module, Blue Tooth module, SAW duplexer PKG, etc.).

Material
An LTCC material that excels in high-frequency properties and a low-resistance conductor (Ag) are burned at the same time:

Features
Because the conductor resistance is low, the electric properties of the circuit have improved. In addition, the LC function, if embedded in the ceramic multilayer substrate, can reduce the product in size and make the conventional function more advanced.

LTCC/RF module

Application
This product is used for mobile communication modules.
(Antenna switch module and front-end module for portable phones)

Material
A module created by installing chip parts on the LTCC multilayer substrate

Features
In contrast with the module of high-frequency communication circuit blocks, this product has been reduced in size and height by installing the LC function on the ceramic multilayer substrate and reducing the number of parts to be installed.

Company Details

Established:    October 26, 1936
Capital:    ¥ 47,869 million (As of March, 2007)
Number of Employees:    Singular:5,626 (As of March, 2007)
Consolidate:    10,407 (As of March, 2007)
Business:    1) Manufacturing and... more