Everything Engineering
Login:   Password:
Not Register?    Sign Up NOW!
Date: 05 September 2008
Google
 
RadiSys Announces New AdvancedTCA(R)  
Search Country   Reset filter

Product Name: RadiSys Announces New AdvancedTCA(R)

Product Description

BARCELONA , Spain , Feb. 14 /PRNewswire-FirstCall/ -- Today at 3GSM, RadiSys Corp. (Nasdaq: RSYS) announced the company is expanding its Promentum(TM)family of AdvancedTCA(R) (ATCA) solutions with seven new products. The Promentum(TM) SYS-6010, the industry's first 10 Gigabit, common managed platform is targeted for use in high-band width network element and dataplane applications. The Promentum SYS-6010 delivers exceptional bandwidth and traffic routing capability and provides the highest throughput node connectivity and compute densities available today. RadiSys is also announcing six new modular building blocks along with datapath and platform management software, all of which are core building blocks of the new Promentum SYS-6010 managed platform.

Until now, ATCA has been targeted for use in ancillary network control applications such as session setup, monitoring and management. With the introduction of the Promentum SYS-6010 managed platform and new modular building blocks, TEMs (telecommunications equipment manufacturers) can now take advantage of ATCA in core traffic-bearing applications that require significantly greater bandwidth and traffic processing capabilities. The Promentum SYS-6010 delivers the highest speed I/O, switching and packet processing capabilities to be implemented in a managed ATCA platform and can be configured for use in applications such as IMS (IP Multimedia Subsystem), Radio Network Controllers, Media Gateways and Call Servers.

"Billions of dollars are being spent upgrading current infrastructure to handle more traffic and serve more subscribers and AdvancedTCA is becoming the architecture that will facilitate rapid developments in the industry," said Ernie Bergstrom , principal analyst with Crystal Cube Consulting. "RadiSys is helping companies realize the benefits of AdvancedTCA on a broader scale with the SYS-6010. Their common managed platform approach will enable TEMs and service providers to keep up with technology advancements and changing customer requirements."

"Our ATCA strategy goes beyond developing individual building blocks," said Scott Grout , RadiSys president and CEO. "Delivering a common managed platform for network element and dataplane applications offers a significant benefit to our customers. The SYS-6010 will allow TEMs to use the same managed platform for a variety of applications, which can reduce their overall development time by up to 50 percent and significantly reduce development, lifecycle and equipment costs."

The SYS-6010 is a fully integrated and validated managed platform designed to address high speed I/O and bandwidth intensive traffic-bearing applications implemented in a flexible and reliable architecture complete with comprehensive system management. The embedded Promentum building blocks are implemented in a modular fashion with seamless interoperability. Modularityis made possible with Promentum building blocks and a suite of Advanced Mezzanine Cards (AMCs), which can be used to configure functions such as general purpose and network processing, input/output, and storage. An exampleis the design of a processor AMC, an AMC carrier blade and a compute and processing module with an AMC site all implemented with the same interoperable specifications. In this example, the processor AMC can be used to provide adjunct processing on the compute blade or paired with the AMC carrier for in-line processing on a line card.

In order to further increase their velocity to market, RadiSys includes data path and platform management software integrated into the Promentum product line. This will enable TEMs to focus on developing the higher value application layer rather then spending precious resource developing basic protocols and platform management solutions. For example the data path and management software that is part of the Promentum products will include both ATM and IP internetworking as well as comprehensive shelf and blade managementthat meets the requirements of today's high-bandwidth ATCA network dataplane and network element applications.

The new Promentum products being announced include the following:

-- The Promentum(TM) SYS-6010 is a fully integrated and validated managed platform. With a 10 Gigabit Ethernet switch and control module, the SYS-6010 offers the highest bandwidth node connectivity, up-link and cross-link capability and the highest processing density per slot. Modular AMC-based I/Oand packet processing functionality provide a modular scalable platform that allows for flexible expansion of both features and system density

-- The Promentum(TM) ATCA-6006 is a new 6-slot, low profile 5U ATCA shelffor smaller/denser systems and cost/space constrained edge and access applications requiring a fewer slots. This shelf compliments the commercially available Promentum 12U ATCA shelf used for larger applications. Applicationsfor the 5U include media gateways, session border controller, Wi-Fi controllerand DSLAM applications.

-- The Promentum(TM) ATCA-2210 is a 10 Gigabit switch and control modulewith a full 10Gigabit switching fabric, integrated Network Timing Sub-system, optional onboard COM Express processor with SAS/SATA disk module, optional shelf management functions, and over 40 Gbps up/cross link capability.

-- The Promentum(TM) ATCA-4300 is a compute processing module with singleor dual Intel(R) dual-core Xeon processors, 2MB secondary (L2) cache, supportfor up to 8GB DDR2-400 ECC registered SDRAM via 4 MiniDIMM sockets, dualGigabit Ethernet Fabric and Base Interfaces. Additional flexibility is provided by two AMC sites and storage connection options, including FibreChannel and SAS/SATA.

-- The Promentum(TM) ATCA-7800 is an asymmetric, multi-processing computemodule consisting of an AMC carrier card with up to four dual-core PowerPCprocessor AMCs, including two 1Gigabit interfaces per AMC and optional security processing.

-- The Promentum(TM) ATCA-7400 is a line card consisting of an AMC carriercard and a choice of interface AMCs such as SONET/SDH, PDH or Gigabit Ethernet

-- The Promentum(TM) AMC-3202 is a SAS hard disk AMC that can add high density storage capability to either the ATCA-4300 compute processing moduleor ATCA-7800 multi-processing line card.

These new Promentum assets expand upon RadiSys' existing commercially available AdvancedTCA offerings that include:

-- Promentum(TM) ATCA-1000: Universal PMC Processing Module, enabling diverse applications such as signaling, softswitches and application mediaservers to be deployed flexibly using PMCs in different configurations and combinations

-- Promentum(TM) ATCA-2100: Switch and Control Module, accommodating both GbE and Fibre Channel switch fabrics for multiple carrier grade server applications in control, services and management planes

-- Promentum(TM) ATCA-3000: Disk Storage Module, providing high performance Fibre Channel storage

-- Promentum(TM) ATCA-4000: Compute Processing Module, providing high performance general purpose application processing through dual Intel(R)Xeon(TM) CPUs

-- Promentum(TM) ATCA-6000: 12U Chassis, providing industry-leading density and enabling three chassis in a standard 42U telco rack

-- Promentum(TM) ATCA-7010: 10 Gigabit Packet Processing Module with modular memory design for the Network Processing Units, socketed RDRAM,optional TCAM memory module, and a fabric interface implemented as a mezzanineto provide fabric choices

-- Procelerant(TM) CE and CR: ComExpress standard COMs(Computer-on-Module) and a carrier development board.

Product Availability

The new Promentum products are scheduled for early availability in mid-2006. For pricing information please contact RadiSys at 800-950-0044.

About RadiSys

RadiSys is the leading provider of advanced embedded solutions for the communications networking and commercial systems markets. Through intimate customer collaboration, and combining innovative technologies and industry leading architecture, RadiSys helps OEMs bring better products to marketfaster and more economically. RadiSys products include embedded boards, platforms and systems, which are used in today's complex computing, processingand network intensive applications.

NOTE: RadiSys is a registered trademark and Promentum is a trademark of RadiSys Corporation. All other names mentioned are trademarks, registered trademarks or service marks of their respective companies.

For more information, contact RadiSys at info@radisys.com orhttp://www.radisys.com or call 800-950-0044 or 503-615-1100.

SOURCE RadiSys Corporation


News stories provided by third parties are not edited by "Site Publication" staff. For suggestions and comments, please click the Contact link at the bottom of this page.

Company Details

Launched in January 2005, AdvancedImagingPro.com (www.advancedimagingpro.com) is providing the electronic imaging community a comprehensive mecca of daily updated industry news, data and photos. AdvancedImagingPro.com’s niche is providing sections... more

More Products of this Company: 16 Megapixel Camera With CameraLink Output, 16 Megapixel Camera With CameraLink Output, 19-Inch Widescreen Monitor, 2.5-Megapixel CMOS Industrial Camera, 3-Way LCD Display, 7" WVGA LCDs with Single-Chip Driver, 70-Inch HD-Level LCD, 8.5-inch WVGA TFT Liquid Crystal Display, ActiveDcam SDK from A&B Software, Actively Cooled Industrial Camera from Redlake, ActiveX SDK for IEEE-1394 Cameras, ActivVisionTools, Adimec Announces the Adimec-1620, a 2-megapixel Camera for Demanding Machine Vision Applications, Adimec's 4-Megapixel Camera, Advanced 1.3-Megapixel Image Sensor, Advanced Controller Chip and Evaluation Kits for High-Resolution Displays, Affordable EMCCD Camera, Agilent Technologies' Flat-Panel-Display, Ambient Light Sensor for Consumer and Automotive Applications, AnaFocus Chooses Altera's Embedded Solutions for Single-Chip Vision System, Andor Sales Expected to Reach £10m, Announces First 1U PCI Express-Based SATA/SAS RAID Array, ARTISTACONTROLCENTER LITE, Basler Vision Components Announces the New Basler Pioneer Camera Series, Basler Vision Components Starts Production of the New Scout Camera Generation, Basler's eXcite Intelligent Camera, Basler's eXcite Intelligent Camera Series, Blue Light Emitting Polymers, CebaTech's C-to-RTL Compiler to Boost Development, Cedip Infrared Offers High Speed Thermal Imaging, Cedip Infrared Systems Has Announced New Long-life Battery and Integrated Screen Options for its Popular Range of Silver High Performance IR Cameras, Cell BE Processor, ColorEdge CG221 LCD Monitor, Compact 1-Megapixel Camera, Compact Cost Effective Interface Controller, CSEM Launches Miniature Vision Sensor System for Real Time Analysis and Response, DALSA Coreco Launches the Genie-M640 for Industrial Imaging, DALSA Image Sensor Chips Power Innovative New Panoramic Camera Products from Seitz, Digital Linear Array Camera, DM720 Series Integrated Positioning Camera, Dongbu Supplies Processing for Advanced CMOS Image Sensors from Foveon, DOUBLE-SIDE DISPLAY PANEL, DTI-Supported Process Development, Dual-band Infrared Camera Sees Through Flames in Furnaces/Boilers, EMX Announces First UV Sensor with Calibration Capability, Extreme Unveils New High Performance M4 and MX4 CCDs, First CompactPCI Express Dual Gigabit Ethernet Board, Flagship Flix(R) Engine Encoding Platform, Fujitsu Develops Industry's First CMOS Integrated Circuit That Recovers Clock and Data at 40-44Gbps, Gigabit Ethernet Camera Has Wide Dynamic Range from JAI, HALCON 8.0, High Contrast 19-Inch Open Frame LCD Display, High Performance IR Camera from Cedip, High Performance IR Camera Showcases at Photonex 06, High-Performance Touchscreen Display Line, High-Speed Camera Adjustable Back Focus, Honeywell Grants Patented Display Technology Rights to IDTech, Honeywell Grants Patented Display Technology Rights to International Display Technology Co., Ltd., IR Camera to Suit the Most Demanding Users from Cedip, JENOPTIK Laser, Large Area Cockpit Display Suite on VH-71, LCD Driver Chip Using Qualcomm Technology, LCD Monitor, LED-Backlit, LED-Backlit LCD Panel for Monitors With Color Quality Rivaling Premium TVs, Lumix DMC-L1, Media Cybernetics Releases Infinity 1 Digital Camera Kit for Clinical, Life Science and Materials Science Research, MicroEmissive Displays Raises Funds and Commences Build, MIRICLE 307K Infrared Camera from Thermoteknix, Multi-Sensor Version of V14 Magnum, Nano-Optical Solutions, NC1805 Pupilla Optical Sensor Chip from Neiricam, NEC Display, NEC Display Solutions Integration Select Program, NEC Display Solutions Introduces Two Trade-Compliant LCD Monitors for the Government Market, NEC Electronics America Unveils Two New LCD Modules, NEC MultiSync LCD2690WUXi and LCD2490WUXi, New Camera from Lumenera Leverages TI DaVinci(TM) Technology to Deliver Higher Quality Intelligent Video Surveillance, New Generation of Cost-effective Grayscale Diagnostic Display Systems, New Generation of Electron Multiplication CCD (emCCD) Sensors from The Cooke Corp., New High-flex DataCELL Cable, New Range of TFT Monitors, Next-Generation LCD Production Line, Nikon's New iNEXIV Multi-Sensor Measuring System Offers 3D Image Documentation, NTSC Camera, Nu Horizons Electronics Signs North American Partnership Pact with AU Optronics, OEM Light Detector/Amplifier, OLED Display and Lighting Markets, OLED Technology to Tohoku Device, OmniVision Introduces Single-Chip Color High Dynamic Range CameraChip Sensor, OSRAM GmbH on Laser Based Displays, PC/104+ MPEG-4 Frame Grabber, PCI Express-to-PCI Bridge, PCO.1200 HS 10bit CMOS Camera System, Photon to Ship Spectral Equipment to Simon Fraser University, Photovoltaics and LEDs, Photron, Inc. Introduces Miniature, Remote, Multi-Head, High Speed Video System, Pixim and Nuvation Announce Partnership to Deliver Customization Services for TCP/IP Cameras, Plasma TVs Enhanced with DuPont's New Generation of DuPont(TM) Fodel(R) Conductive Pastes, PMC-Sierra for Optical Access Aggregation, Point Grey Research, Point Grey Research Unveils the Bumblebee2, Point Grey Research Unveils the Bumblebee2, Polycrystaline Silicon Mobile Displays Have Hit Mainstream, Power Analog Microelectronics and TSMC Collaborate to Develop BCD Technology, Powerful Monochrome and Color Cameras, RESEARCHERS DEVELOP LCD PANEL THAT PRODUCES LIFELIKE 3-D IMAGES, Rolera-MGi FireWire EMCCD Camera, Samsung Develops the World's Smallest 8.4-megapixel CMOS Image Sensor, Samsung Electronics Brings Brighter Images to Mobile Devices in Broad Daylight, Second LCD Film Prod'n Plant, Sensor and LED Products in Nuremberg at SENSOR, Shortwave IR Camera, Sony Adds Windows XPe Compatibility for Smart Camera, Sony Enters the D-SLR Camera, SpatiaLight and Foreal Spectrum to Develop First Ever Light Emitting Diode Powered LCoS Light Engine for High Definition Televisions, Specialty Stand-Alone Monitor, SRV CCD Digital Camera, Sub-assemblies for Major Flat Panel Display, SVS340 Camera, Technest Holdings to Further Develop Remote Smart Optical Sensor for the U.S. Army, Test Carbon Fiber to Make Tiny, Cheap Video Displays, The Report 'Flat Panel Display Applications: Trends and Forecasts, 2007 Edition' Analyzes 22 Different Products, TI Introduces 10-bit, Triple Analog-to-Digital Converter Family, TI's Expanded Fully-Differential Amplifier Portfolio Drives Easy, Toolkit for .NET at AIIM On Demand Expo & Conference, Toshiba Announces New 3-Chip Precision Camera, Toshiba Camera Uses Peltier Cooled EMCCD for Extreme Low-Light, 30 Frame Per Second Color Imaging, Toshiba IK-WB02A Network Camera Available In Kit With Power Supply, Mount & Choice Of Lenses, Toshiba Teli CS6910F Factory Automation Camera, Toshiba Teli CS6910G Gigabit Ethernet Color Camera, Toshiba Teli Machine Vision Camera, TracePro 4.0 Optical Design Software, TW8810 In-Car LCD Display Processor for Sharp Dual Directional Viewing LCD Panels, Ultra-High Speed Imaging Value From Cordin, Ultra-High-Speed FPGA-Based Data Compression Technology, Ultracompact, Light Shortwave-infrared Camera Introduced, Ultraviolet Camcorder, Visual Experience of LCDs, Visual Experience of LCDs With Advanced UV Polymer Optical Bonding, World's Slimmest Mobile LCD Screen, X-ray Camera, XP IR Image Fusion Camera
Related Products: Actively Cooled Industrial Camera from Redlake, Adimec Announces the Adimec-1620, a 2-megapixel Camera for Demanding Machine Vision Applications, Adimec's 4-Megapixel Camera, Announces First 1U PCI Express-Based SATA/SAS RAID Array, Basler Vision Components Announces the New Basler Pioneer Camera Series, CebaTech's C-to-RTL Compiler to Boost Development, EMX Announces First UV Sensor with Calibration Capability, Extreme Unveils New High Performance M4 and MX4 CCDs, LED-Backlit, Media Cybernetics Releases Infinity 1 Digital Camera Kit for Clinical, Life Science and Materials Science Research, PCI Express-to-PCI Bridge, Photon to Ship Spectral Equipment to Simon Fraser University, Toshiba Announces New 3-Chip Precision Camera, TracePro 4.0 Optical Design Software, TW8810 In-Car LCD Display Processor for Sharp Dual Directional Viewing LCD Panels, X-ray Camera
Home | Members.Benefit | Privacy.Policy | Bookmark.This.Page | Contact.Us
© 2006 - 2007 4engr. All Rights reserved |Recommended Engineering Sites:| Center for Respect of Life and Environment | Internet Dictionary|Enginering intent(Engineering Events) | Map Archive