|
Product Name: Enhanced Plastic
Product Description
In response to the growing demand for enhanced plastic (EP) products in defense and aerospace applications, Texas Instruments (TI) is releasing a line of EP devices with additional value-added qualifications and processing. This device portfolio includes digital signal processors, analog, FIFO and logic catalog products. These products will complement the broad portfolio of military grade ceramic devices that are currently produced by TI.
These EP products are cost-effective catalog devices that are available in plastic packages. They offer benefits to customers that are not available with the purchase of commercial devices.
Product Benefits:
Controlled baseline (one assembly/test site, one fabrication site)
Enhanced product change notification
Extended temperature performance (specific temperature ranges are stated on the datasheets and may be as great as -55°C to 125°C)
Qualification pedigree
Customer notification of major changes: process, materials, electrical performance, lead finish, mold compound and manufacturing location.
Assurance from TI that the device will perform to datasheet electrical specifications in environments that require extended temperatures.
Nickel-Palladium-Gold or Tin-Lead lead finishes are standard.
The new EP portfolio from TI will alleviate many reliability concerns typically associated with upscreening.
Reliability Concerns Associated with Upscreening:
Yield loss and damage due to electrical overstress and handling
Mechanical damage which causes moisture issues
Burn-in which can cause lead finish degradation
Lack of support by IC manufacturers
Few upscreening test facilities have the ability to test complex parts
TI's new EP products will offer an alternative to upscreening for customers who believe that a plastic packaged part is suitable for their particular application. Although the EP products (which are not MIL-PRF-38535 (QML) qualified) receive additional testing and process verification over and above their commercial counterparts, they may still not be suitable for all environments. For those applications that require a ceramic/hermetic packaged integrated circuit, TI has an expansive product line to meet their needs. Those products can be found within the Military Semiconductors Selection Guide 2004-2005.
In addition to the products listed below, TI will evaluate the release of other EP devices based on customer needs. A Feedback Form is available for customers who would like to request an additional release.
Company Details
Few companies can match the 75-year record of innovations from the inventive minds at Texas Instruments. These advances include such world-changing innovations as the first integrated circuit and the first electronic handheld calculator. ... more
| More Products of this Company: |
Advanced Bus Interface, Amplifiers & Linear, ASIC, Auto 3-State, Automotive : Analog and Mixed Signal, Automotive : Digital Logic, Bias Vcc, Bus-Hold, C2000, C2000 Controllers, C2000™ High Performance 32-bit Controllers, C5000, Clocks & Timers, Data Converters, DDR-I, DDR-II, Device Nomenclature, Digital Logic, Discovery 1100, Discovery 3000, DSP, DSP-Digital Signal Processing, Dynamic Output Control, Interface, Internal Diode, I²C, Little Logic, Live Insertion, Logic Market Consolidation, Military Analog & Mixed Signal, Military DSP, Military FIFOs, Military Logic, Military Multichip Module, Military Programmable Array Logic, Military Unpackaged Die Products, Military Unpackaged Die Products, MSP430 Ultra-Low Power Microcontrollers, New Product Announcements, PC100/133, PMP and Mixed Signal, Power Management, RF/IF Components, Series Damping Resistors, Series Damping Resistors, Signal Switches, Standard Linear, Storage Products Group, Switches & Multiplexers, Temperature Sensors & Control ICs, TI-RFid™, TMS470 16/32-Bit RISC Microcontrollers for Automotive Applications, TMS470 ARM7TDMI®-Based Industrial MCUs, TMS470 Family Roadmap, Translation, Widebus |
| Related Products: |
Advanced Bus Interface, Device Nomenclature, Little Logic, Logic Market Consolidation, Military DSP, Military FIFOs |
|
|
|
|