CMOS Imagers Purchased in Packages
CMOS Imagers Purchased in Die Form
CMOS Imagers Upgrade - Product

CMOS Imagers - General Policies

Design/Manufacturing

File Title and Description
PDF TN-00-08: Thermal Applications
PDF TN-00-09: Accelerate Design Cycles with Micron Simulation Models
PDF TN-00-15: Recommended Soldering Parameters
PDF TN-00-17: Timing Specification Derating for High Capacitance Output Loading
PDF TN-00-20: The Value of Signal Integrity

Customer

File Title and Description
PDF CSN-12: Product Change Notification (PCN) System

Product Return (RMA)

File Title and Description
PDF CSN-07: Returned Material Authorization (RMA) Procedures

Shipping

File Title and Description
PDF CSN-04: Shipping Information: Quantities and Weights
PDF CSN-05: Environmental Programs
PDF CSN-06: Electronic Data Interchange
PDF CSN-08: ISO System Management Standards
PDF CSN-11: Product Mark/Label

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CMOS Imagers Purchased in Packages

Materials

File Title and Description
PDF TN-00-01: Moisture Absorption in Plastic Packages

Manufacturing

File Title and Description
PDF TN-00-15: Recommended Soldering Parameters

Packaging

File Title and Description
PDF CSN-15: Tape and Reel Procedures
PDF CSN-16: Micron Packaging
PDF CSN-17: Packaging Materials
PDF CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging

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CMOS Imagers Purchased in Die Form

Materials

File Title and Description
PDF TN-00-16: Singulated Die Shipping Media
PDF CSN-19: Reconstructed Wafer Packaging

Manufacturing

File Title and Description
PDF CSN 27: 300mm Back-Side Wafer ID
PDF TN-09-07: Imager Wafer Cleaning for details
PDF TN-09-08: Imaging Wafer Detaping Procedures
PDF TN-00-19: Thinning Considerations for Wafer Products

Quality and Reliability

File Title and Description
PDF CSN-24: Electrostatic Discharge (ESD) Precautions for the Handling and Assembly of Semiconductor Die and Wafers
PDF TN-00-14: Understanding the Quality and Reliability Requirements For Bare Die Applications

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CMOS Imagers Upgrade - Product

Definition

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File Title and Description
PDF TN-09-01: Upgrading from the MCM20027 to the MT9M001 Image Sensor
PDF TN-09-02: Upgrading from the OV9620 to the MT9M001 Image Sensor
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Date: 02 December 2008
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CMOS Imaging Technical and Customer Service Notes

Product Name: CMOS Imaging Technical and Customer Service Notes

Product Description

CMOS Imagers - General Policies
CMOS Imagers Purchased in Packages
CMOS Imagers Purchased in Die Form
CMOS Imagers Upgrade - Product

CMOS Imagers - General Policies

Design/Manufacturing

File Title and Description
PDF TN-00-08: Thermal Applications
PDF TN-00-09: Accelerate Design Cycles with Micron Simulation Models
PDF TN-00-15: Recommended Soldering Parameters
PDF TN-00-17: Timing Specification Derating for High Capacitance Output Loading
PDF TN-00-20: The Value of Signal Integrity

Customer

File Title and Description
PDF CSN-12: Product Change Notification (PCN) System

Product Return (RMA)

File Title and Description
PDF CSN-07: Returned Material Authorization (RMA) Procedures

Shipping

File Title and Description
PDF CSN-04: Shipping Information: Quantities and Weights
PDF CSN-05: Environmental Programs
PDF CSN-06: Electronic Data Interchange
PDF CSN-08: ISO System Management Standards
PDF CSN-11: Product Mark/Label

top

CMOS Imagers Purchased in Packages

Materials

File Title and Description
PDF TN-00-01: Moisture Absorption in Plastic Packages

Manufacturing

  • Reflow, Wave Solder, and Hand Soldering Parameters
File Title and Description
PDF TN-00-15: Recommended Soldering Parameters

Packaging

File Title and Description
PDF CSN-15: Tape and Reel Procedures
PDF CSN-16: Micron Packaging
PDF CSN-17: Packaging Materials
PDF CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging

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CMOS Imagers Purchased in Die Form

Materials

  • Micron ships the die in a reconstructed wafer form
File Title and Description
PDF TN-00-16: Singulated Die Shipping Media
PDF CSN-19: Reconstructed Wafer Packaging

Manufacturing

  • Micron strongly recommends washing the wafers as a step just before assembly.
File Title and Description
PDF CSN 27: 300mm Back-Side Wafer ID
PDF TN-09-07: Imager Wafer Cleaning for details
PDF TN-09-08: Imaging Wafer Detaping Procedures
PDF TN-00-19: Thinning Considerations for Wafer Products

Quality and Reliability

File Title and Description
PDF CSN-24: Electrostatic Discharge (ESD) Precautions for the Handling and Assembly of Semiconductor Die and Wafers
PDF TN-00-14: Understanding the Quality and Reliability Requirements For Bare Die Applications

top

CMOS Imagers Upgrade - Product

Definition

  • Describes hardware differences between part numbers listed

Company Details

Follow Micron's progression since its inception in 1978 to becoming one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAM, Flash memory, CMOS image... more

File Title and Description
PDF TN-09-01: Upgrading from the MCM20027 to the MT9M001 Image Sensor
PDF TN-09-02: Upgrading from the OV9620 to the MT9M001 Image Sensor
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