|
Product Name: MCP Webinar
Product Description
SoC, SiP, PoP, MCP? Choose the Right Die-Stacking Solution
No one die-stacking technology suits every application. Each offers different
benefits in terms of four key design elements: board space, height, performance,
and cost. Micron senior applications engineer Chris Pages explains the
advantages and disadvantages of four popular stacking solutions—SoC, SiP, PoP,
and MCP—in this 20-minute online presentation. Let Micron’s expertise help
you pick the best technology for your application. Click the "View
Now" link below to begin the presentation.
View
Now
This presentation is available to Micron.com users; if you’re not yet
registered, you’ll be guided through a simple sign-on process.
Company Details
Follow Micron's progression since its inception in 1978 to becoming one of
the world's leading providers of advanced semiconductor solutions. Through its
worldwide operations, Micron manufactures and markets DRAM, Flash memory, CMOS
image... more
| More Products of this Company: |
1.3 Megapixel, 2 Megapixel, 3.1 Megapixel, 5 Megapixel, 8 Megapixel, Burst A/D MUX PSRAM, CellularRAM, CMOS Imaging Technical and Customer Service Notes, CMOS Lens Selection and Suppliers, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, FBDIMM, High Speed, Managed NAND, MiniDIMM, Mobile DDR SDRAM, Mobile SDRAM, Motherboard Tests, NAND Flash Applications, NAND Flash Software, NAND Flash Technical Notes, PSRAM Technical Notes, RDIMM, RLDRAM® Memory, SDRAM, SODIMM, UDIMM, VGA, VLP DIMM, VLP MiniDIMM |
|
|
|
|
