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Product Name: FBDIMM
Product Description
With the stub-bus topology of typical DRAM memory subsystems, the memory
controller data signals must be electrically connected to the data lines of every
DRAM module on the bus. Today’s server designs use as many as 72 connections,
each of which provides an opportunity for signal degradation and
errors—especially as speeds increase.
Micron’s FBDIMMs feature an advanced memory buffer (AMB)
chip that overcomes these limitations so designers can put more memory into
their servers and still keep errors low.
mproved Error Detection
Address/command soft errors can disrupt server performance and reliability.
To help lessen the occurrence of errors, Micron’s FBDIMMs incorporate an
enhanced cyclic redundancy check (CRC) that provides greater data and
address/command protection than traditional server modules. Designers can also
configure the CRC to suit their applications.
Advanced Memory Buffer
The AMB maintains signal integrity and improves error detection methods,
reducing soft errors. Using a point-to-point architecture, the AMB transmits
signals among the controller, memory devices, and other modules without
sacrificing signal integrity—or speed. Unlike modules with a parallel path
(stub-bus) architecture, FBDIMMs move data serially between the AMB and memory
controller.
This simplified structure gives FBDIMMs a lower pin count and faster
transmission rates than conventional architectures. Plus, they can perform reads
and writes simultaneously, eliminating the read-to-read delay between data
transfers. With speeds up to 4.8 Gb/s, Micron's FBDIMMs enable fast buffering to
optimize server performance.
Company Details
Follow Micron's progression since its inception in 1978 to becoming one of
the world's leading providers of advanced semiconductor solutions. Through its
worldwide operations, Micron manufactures and markets DRAM, Flash memory, CMOS
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